TSMC to build $12bn advanced semiconductor fab in Arizona, US
May 18, 2020 – Taiwan Semiconductor Manufacturing (TSMC) is planning to build an advanced semiconductor fab in Arizona, US.
The Taiwan-based company plans to spend about $12bn on the project between 2021 and 2029.
Scheduled for commissioning in 2024, the new facility will feature TSMC’s 5-nanometer technology for semiconductor wafer fabrication and will have a production capacity of 20,000 semiconductor wafers per month.
The project is expected to create over 1,600 jobs directly, and thousands of indirect jobs in the semiconductor ecosystem.
TSMC plans to commence construction on the project in 2021. The project, upon completion, will mark the company’s second manufacturing site in the US.
In a press statement, TSMC said: “This US facility not only enables us to better support our customers and partners, it also gives us more opportunities to attract global talents.
“This project is of critical, strategic importance to a vibrant and competitive US semiconductor ecosystem that enables leading US companies to fabricate their cutting-edge semiconductor products within the United States and benefit from the proximity of a world-class semiconductor foundry and ecosystem.”
The firm currently operates a fab in Camas, Washington and design centres in Austin, Texas and San Jose, California.
TSMC manufactures semiconductors for applications in the computer, communications, consumer, industrial and standard segments and are used in a variety of end markets including mobile devices, high-performance computing, automotive electronics and the Internet of Things (IoT).
Employing more than 51,000 people, TSMC also operates three 12-inch wafer GIGAFAB fabs, four 8-inch wafer fabs, and one 6-inch wafer fab in Taiwan.